Surface mount land patterns : configurations and design rules / developed by the Institute for Interconnecting & Packaging Electronic Circuits
Publication details: Lincolnwood, Ill. : Institute for Interconnecting & Packaging Electronic Circuits, 1987Description: 98 p. : ill ; 28 cmSubject(s): Electronics | United States (country of publication)Other classification: 621.38.002.3Item type | Current library | Call number | Status | Notes | Date due | Barcode |
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ST621.38.002.3SUR | Available | 6509 | 30398 |