TY  - GEN
ED  - American National Standards Institute
ED  - Institute for Interconnecting & Packaging Electronic Circuits
TI  - Surface mount land patterns: : configurations and design rules
PY  - 1987///
CY  - Lincolnwood, Ill.
PB  - : Institute for Interconnecting & Packaging Electronic Circuits
KW  - Electronics
KW  - United States (country of publication)
ER  -